RTUEE / EC / EEEYr 2019 · Sem 72019

Q7VLSI Design

Question

16 marks

4. Draw and explain any two logic Ckt from - (i) NORA logic (ii) DRAM (iii) DOMINO logic (iv) NP logic. [2x8=16]

Answer

NORA Logic and DRAM (Dynamic Random Access Memory)

NORA Logic: Alternating N-block and P-block StagesN-block(dynamic, NMOS PDN+ precharge PMOS)P-block(dynamic, PMOS PUN+ precharge NMOS)N-block

NORA (NO RAce) logic is a clocked dynamic CMOS logic family designed to allow direct cascading of alternating dynamic logic stages without inserting static buffer/inverter stages between every pair of dynamic gates, which conventional domino logic requires. NORA achieves this by alternating between two types of dynamic blocks: N-blocks, which use an NMOS pull-down evaluation network (precharged high via a PMOS precharge transistor, similar to standard domino logic), and P-blocks, which use a PMOS pull-up evaluation network (precharged low via an NMOS precharge transistor, i.e. the logical dual structure). Because N-blocks and P-blocks precharge to opposite logic levels and evaluate with opposite clock-phase relationships, an N-block's dynamically-evaluated output (which only ever falls monotonically during evaluation, just as in domino logic) can directly drive the gate inputs of a following P-block without an intervening static inverter, since the P-block's PMOS pull-up network correctly interprets a monotonically-falling input as expected.

This alternating N-block/P-block cascading eliminates the mandatory static-inverter overhead of domino logic between every stage, reducing both silicon area and the additional delay/power that static buffers would introduce, at the cost of requiring careful, disciplined design of alternating clock-phase relationships and gate ordering across the pipeline to maintain the correct monotonicity assumptions throughout the cascade - a design discipline that gives the logic family its name (avoiding 'races' between the precharge and evaluate transitions of adjacent stages that could otherwise cause incorrect intermediate glitches to propagate).

DRAM (Dynamic Random Access Memory)

1-Transistor DRAM CellWord Lineaccess NMOSstorage capacitor CsVrefBit Line

DRAM stores each bit of data as electric charge on a small storage capacitor Cs, accessed through a single NMOS access transistor whose gate is connected to the word line and whose drain/source path connects the storage capacitor to the bit line. When the word line is asserted, the access transistor turns on, connecting the storage capacitor to the bit line, allowing either a write operation (the bit-line driver forces the capacitor to charge or discharge to the desired logic level) or a read operation (the small charge stored on Cs is shared with the much larger bit-line parasitic capacitance Cbl, producing a small voltage perturbation on the bit line that a sense amplifier detects and amplifies to a full logic level).

Because the storage capacitor Cs inevitably leaks charge over time (through the access transistor's subthreshold leakage current and junction leakage at the storage node), DRAM requires periodic refresh operations - every row must be read out and rewritten at full strength at a regular interval (typically every few tens of milliseconds) before the stored charge decays enough to be misread, which is the defining characteristic that makes DRAM 'dynamic' (as opposed to SRAM, which holds its stored state indefinitely via cross-coupled feedback as long as power is supplied, requiring no refresh). This need for refresh circuitry adds design complexity and a small periodic power/bandwidth overhead, but is more than compensated for by DRAM's dramatically smaller per-bit cell area (a single transistor plus a single capacitor, versus SRAM's six transistors per bit), which is precisely why DRAM is the technology of choice for high-density main memory, while SRAM (faster, no refresh needed, but larger and more power-hungry per bit) is reserved for smaller, speed-critical applications such as processor cache memory.

Comparing NORA logic and DRAM as two distinct VLSI logic/memory circuit techniques highlights the breadth of design considerations spanning combinational-logic-speed optimization versus data-storage-density optimization within the same underlying CMOS technology. NORA logic exemplifies the broader family of clocked dynamic logic circuits (which also includes domino logic, NP-domino/zipper CMOS, and cascode voltage switch logic), all of which trade the unconditional logical robustness and zero static power consumption of fully static CMOS gates for higher switching speed and reduced transistor count per logic function, at the cost of requiring careful multi-phase clocking discipline, susceptibility to charge-sharing and leakage-induced dynamic-node corruption if evaluation is delayed too long, and reduced noise immunity compared to static gates.

DRAM, by contrast, exemplifies the memory-density-optimized side of VLSI design, where a single transistor plus capacitor cell achieves roughly one-sixth the area of an equivalent SRAM cell, at the cost of requiring not only periodic refresh circuitry but also a considerably more complex sense-amplifier and precharge circuit design to reliably detect and restore the very small charge-sharing voltage signal produced on the bit line during a read access (since the storage capacitor is deliberately made as small as possible to maximize density, while the bit-line parasitic capacitance it must share charge with is comparatively much larger, producing bit-line voltage swings during a DRAM read access typically in the range of only a few hundred millivolts, requiring highly sensitive, carefully balanced differential sense amplifiers to correctly resolve).

Both NORA logic and DRAM ultimately illustrate a recurring theme throughout VLSI circuit design: exploiting the temporary charge-storage capability of a node's own parasitic or dedicated capacitance (the dynamic evaluation node in NORA/domino logic, or the explicit storage capacitor in a DRAM cell) to reduce transistor count and/or improve switching speed relative to a fully static, continuously-driven circuit alternative, while accepting the added complexity of managing that stored charge's inevitable, finite retention time through careful timing discipline (for dynamic logic) or explicit periodic refresh (for DRAM) - a trade-off pattern that recurs throughout digital IC design wherever area, speed, or power constraints motivate designers to depart from the simplicity of fully static, continuously-restoring circuit topologies.

Consequently, a circuit designer choosing between dynamic logic families like NORA and memory technologies like DRAM is never selecting one universally superior approach, but rather matching the specific circuit technique to the specific design goal (raw combinational switching speed for NORA-style dynamic logic, versus maximum bit-storage density for DRAM), a decision-making pattern that recurs throughout the entire discipline of VLSI design.

This same design-technique-selection principle extends naturally to the two remaining logic families mentioned in the question, DOMINO logic and NP/Zipper CMOS, each occupying a further distinct point along the speed-versus-robustness design spectrum available to the VLSI circuit designer.

Recognizing these distinctions is what allows an experienced VLSI designer to select the most appropriate circuit family for each block of a larger chip design, rather than defaulting to a single logic style throughout.

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