Q13Engineering Physics
Question
For intrinsic semiconductor with a band gap , calculate the density of electrons and holes at .
Answer
The intrinsic carrier density of a semiconductor is a measure of the thermally generated electron-hole pairs. For a material with a bandgap of (like Germanium) at , it is calculated using the mass action law formula to be approximately .
In a pure, perfect (intrinsic) semiconductor crystal, at absolute zero (), the valence band is completely full and the conduction band is entirely empty; the material acts as a perfect insulator. However, as the temperature rises above , thermal energy causes some electrons to break their covalent bonds and jump across the forbidden energy gap () into the conduction band. Every electron that makes this jump leaves behind a positively charged vacancy in the valence band, known as a 'hole'. Because they are created in pairs, the concentration of electrons in the conduction band () is always exactly equal to the concentration of holes in the valence band (). This fundamental concentration is called the intrinsic carrier density, , where .
The Mathematical Model
By applying Fermi-Dirac statistics to the density of states in the conduction and valence bands, solid-state physics provides a rigorous formula for as a function of temperature () and bandgap energy ():
Where: - is a material-dependent constant derived from the effective masses of electrons and holes (for Germanium, ). - is the absolute temperature (). - is the Boltzmann constant ( or ). - is the bandgap energy ().
Step-by-Step Calculation
First, we evaluate the thermal energy parameter at room temperature ():
Next, we calculate the exponent factor. The exponent determines the probability of an electron acquiring enough thermal energy to cross the gap:
Now, we evaluate the exponential term:
Finally, we calculate the pre-exponential factor and multiply them together. Given the known constant for Germanium, we get:
This result highlights a critical engineering reality: even at room temperature, thermal generation produces a massive charge carriers per cubic meter in Germanium. This is why Silicon (, yielding a much lower ) is vastly preferred over Germanium for modern integrated circuits, as it suffers from significantly lower leakage currents at high operating temperatures.